IET Hong Kong presents:

Webinar: Solder joint endurance reliability More Events

Speaker:
Mr Ichizo Sakamoto PE Japan APEC Engineer IEC
Date/Time:
Saturday 15th January 2022 @ 9:00 AM Local time (UTC +9 hours)
Venue:
Online via Zoom
Details:
"At the lecture, solder joint endurance reliability is lectured based on the IEC standard (IEC 62137-3: 2011, Electronics assembly technology-Part 3: Selection guidance of environmental and endurance test methods for solder joints) The lecturer explains the reliability tests on the basic three viewpoints of "stress," "mechanism," and "acceleration coefficient.""

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